OFERTA FORMATIVA DCM - FCT/UNL
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“3 chamber” PECVD
Location: Clean room CEMOP – thin-film deposition lab
Responsible: Tiago Mateus, Hugo Águas
Description:
Plasma-enhanced chemical vapor deposition (PECVD) tool with 3 dedicated chambers for deposition of Si-based thin films.
Specifications:
• 3 isolated PECVD chambers dedicated to intrinsic, n and p doped silicon deposition
• 8 gas lines with mass flow controllers (SiH4, H2, PH3, TMB, CH4, O2, Ar, CH4)
• 3 RF generators
• 1 VHF generator (27MHz)
• Heated chambers up to 300°C
• Gas scrubber for emission treatment
Responsible: Tiago Mateus, Hugo Águas
Description:
Plasma-enhanced chemical vapor deposition (PECVD) tool with 3 dedicated chambers for deposition of Si-based thin films.
Specifications:
• 3 isolated PECVD chambers dedicated to intrinsic, n and p doped silicon deposition
• 8 gas lines with mass flow controllers (SiH4, H2, PH3, TMB, CH4, O2, Ar, CH4)
• 3 RF generators
• 1 VHF generator (27MHz)
• Heated chambers up to 300°C
• Gas scrubber for emission treatment
